The Advancements in Thermal Management conference educates attendees on the latest in thermal management and temperature mitigation, covering topics such as electronics cooling, thermal materials/TIMS, air and liquid cooling, heat pipes, temperature sensing and control, electronics packaging, and system design for optimizing thermal properties. It will be hosted in Denver, Co. on August 6th and 7th.
The conference is organized for design engineers, academia, system engineers, material scientists, CTOs and R&D manager in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
Attend if You Work in These Industries:
Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom, Batteries, and more.
